PowerSilicon, Inc. (PSI), is an ODM/OEM service provider in the power semiconductor field. It was founded in 1987 and its major products include Power Discrete and Power Module Devices (TVS ESD Protection Devices, Diodes, Schottky, MOSFETs, SCRs, Transistors, IGBTs, Thyristors) and LED Display Devices (Alphanumeric displays, Seven Segment displays, Dot Matrix displays, ID Driver Built-in displays, Graphic displays) for the industrial, consumer, computer, telecommunication and automotive applications. It is a global joint venture group, with facilities located in Asia, Europe and America which function either as design centers, manufacturing plants, and/or marketing and sales offices.

LOCATION

PSI has partnered with several global semiconductor designers and suppliers of semiconductor components with the aim of developing high-density and efficient power devices, and the team-up has generated a dynamic synergy that resulted in several new advancements in the assembly process, design, and packaging of power devices suitable for the advanced requirements of today’s every-growing market. The main base of its manufacturing operations is in the Asian region, such as in China and the Philippines, with factories boasting of manufacturing and assembly facilities and wafer FAB lines. The plants have positioned themselves as engineering-driven, product-oriented manufacturers and have assembly and testing process capabilities for various microelectronic packages.

DESIGN SERVICES AND ACHIEVEMENTS

To-date, several new versions of TVS Protection Devices, Digital Transistors, Trench MOSFETs and Trench IGBT devices, to name a few, have already been designed or are currently under development by our research and design team. A new, compact surface mount package, called the Powerpak®, has also been jointly developed. The Powerpak® package design enables PSI to produce high-power, low thermal resistance, high-average forward rectified current Schottky and Fast Recovery devices in a low and thin outline ideal for miniaturized products such as mobile phones, portable GPS and PDA devices, portable audio, DC-to-DC converters, MP3 players and power management devices. Recent design breakthroughs have also been achieved with our series of TVS ESD Protection devices, with TVS array devices packaged into small-footprint surface mount and chip scale packages to give added flexibility to design engineers in miniaturizing devices and maximizing board space and design of portable applications such as mobile handsets, PC-/notebook USB ports, DVI interfaces, monitors and flat panel displays, video graphics cards, SIM ports, ATM interfaces, cordless telephones, wireless data (WAN/LAN) systems, PDAs and HDMI.Not content in resting on its laurels, the partnership’s research team is even now intent on coming out with more advanced ideas in the power device field to sustain us aggressive steps towards being one of the world’s leaders in power device solutions.

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